Electronics
Oxone™ monopersulfate compound is a free flowing powder chemical microetchant used for copper cleaning and surface preparation in printed wiring board fabrication. The Oxone™ product contains acidic potassium monopersulfate (KMPS) as its active ingredient. KMPS provides more efficient oxidation of copper. This chemistry gives better etched copper surface morphology with uniform distribution of well-defined grain structure compared to not-in- kind competitive products, such as hydrogen peroxide/sulfuric acid (peroxide) and sodium persulfate (SPS).
Optimized grain structure produced by Oxone™ chemistry gives better adhesion for metal plating, dry film, final finishes and IC packaging. Oxone™ chemistry provides the predictable and stable etch rates needed to improve process control values, as required for multi-step processing of thin foils, HDI, and SAP processes. Oxone™ monopersulfate compound also provides the high copper solubility and the ease of use needed in today’s fast paced PCB fabrication environment.
- Free-flowing powder
- Uniform, predictable etch rate
- High etch rate
- Long bath life
- Excellent bonding morphology
- High copper loading
- No stabilizer required
- Good rinsibility
Oxone™ microetchant is used in the surface preparation of copper laminate and foil prior to bonding; photoresist film, metal plating, solder mask, and final finish. Bond strength is critical to maintaining PCB integrity throughout the life cycle of today’s printed circuit board. Higher soldering temperature and higher density often means increased temperature changes that cause temporary twisting and warping to stress adhesive and cohesive bonds. Oxone™ microetchant bonding morphology improves bond strength.
Chemistry based on KMPS is the best solution to provide:
- Surface free of metal oxides
- Surface free of unwanted organic residues
- Best bonding surface for downstream applications